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A 45° metallurgical cross-section through the BGA corner SPADs, examined under a Scanning Electron Microscope at 2000x magnification. Any crack >1µm is a failure. "Crack free" means zero observable intermetallic separation.

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The term "SPAD next crack free" refers to the condition where this stack-up, after assembly and through the product's lifetime, exhibits at the intermetallic interface, within the bulk solder, or at the pad-to-laminate junction.